Reldan will be attending the 2022 International Microelectronics Assembly and Packaging Society (IMAPS) in Boston, MA from October 4th to 5th, 2022.

The IMAPS Symposium, this year, will focus on “packaging technology enabling the new normal.”  Reldan can provide innovative solutions to your precious metal waste refining and recycling challenges. Make sure to stop by our booth to say hello, or setup a meeting in advance. We look forward to partnering with you and your team to handle your ever evolving needs and challenges, today and in the future.

Do you want to see our solutions now? Click Here

When: October 4-5

Where: Boston, MA

Booth#: 401